Fuzz Button® Interposers / Connectors
Custom Interconnects designs and manufactures a comprehensive line of customized
Interposers and Connectors to support high density PCB stacking, packaging adaptation
and solderless device mounting.
Fuzz Button® Interposers / Connectors
Available Product Designs
Stackup Configuration Choices
Production is scalable from a single piece all the way to full OEM production quantities.
Supported mating pad types include PGA, BGA, LGA, CGA and custom packaging. Most
customers today utilize the Center-to-Center Contact Pitch of 1mm. The 1mm pitch is
often regarded by customers as the perfect balance between pad/array size optimization
and cost containment, while still offering excellent signal isolation and prevention of
crosstalk. But, when the application requires a differing approach, we do offer a full line of
possible mating pitches including .4mm, .5mm, .65mm, .8mm, 1mm, 1.27mm plus many
custom pitches. And with I/O counts as high as 5000, we have an interconnect solution for
any fine pitch / high density requirement imaginable.
While most applications require just a single use permanent mounting connection, Fuzz
Button® Interposers and Connectors can actually be reutilized many hundreds or
sometimes even thousands of times. This flexibility is ideal to allow for interconnect
and/or device repurposing or in the event of a device failure. And with the inclusion of
Hardhats into the stackup, mating cycles up to 500,000 are achievable with no significant
signal degradation.
A wide array of high quality interconnect body/carrier materials are available to choose
from, including Ultem®, Teflon®, PEEK®, Torlon®, FR4, G10, Formex®, Rogers,
Aluminum and Brass,as well as any other commercially available dielectric plastic or
metal you may prefer.
For interconnects that need to go airborne, stay terrestrial or even go underground,
Fuzz Button® technology delivers the reliability you need!
Custom Interconnects designs and manufactures a comprehensive line of customized
Interposers and Connectors to support high density PCB stacking, packaging adaptation
and solderless device mounting.
Fuzz Button® Interposers / Connectors
- Best in Signal Integrity
- Impedance Matching
- Long Life
- High GHz Frequency
- High Current Capable
- High Compliance
- Harsh Environmentals
- Lightweight
- Low Profile
Available Product Designs
- PCB to PCB Interposer
- Device to PCB Interposer
- Production Socket
- Mezzanine Connector
- Pitch Adapter Interposer
Stackup Configuration Choices
- Fuzz Button® Only
- Fuzz Button® / Fuzz Button®
- Fuzz Button® / Conductive Spacer / Fuzz Button®
- Fuzz Button® / Hardhat
- Fuzz Button® / Solder Pin
- Hardhat / Fuzz Button® / Hardhat
- Hardhat / Fuzz Button® / Solder Pin
Production is scalable from a single piece all the way to full OEM production quantities.
Supported mating pad types include PGA, BGA, LGA, CGA and custom packaging. Most
customers today utilize the Center-to-Center Contact Pitch of 1mm. The 1mm pitch is
often regarded by customers as the perfect balance between pad/array size optimization
and cost containment, while still offering excellent signal isolation and prevention of
crosstalk. But, when the application requires a differing approach, we do offer a full line of
possible mating pitches including .4mm, .5mm, .65mm, .8mm, 1mm, 1.27mm plus many
custom pitches. And with I/O counts as high as 5000, we have an interconnect solution for
any fine pitch / high density requirement imaginable.
While most applications require just a single use permanent mounting connection, Fuzz
Button® Interposers and Connectors can actually be reutilized many hundreds or
sometimes even thousands of times. This flexibility is ideal to allow for interconnect
and/or device repurposing or in the event of a device failure. And with the inclusion of
Hardhats into the stackup, mating cycles up to 500,000 are achievable with no significant
signal degradation.
A wide array of high quality interconnect body/carrier materials are available to choose
from, including Ultem®, Teflon®, PEEK®, Torlon®, FR4, G10, Formex®, Rogers,
Aluminum and Brass,as well as any other commercially available dielectric plastic or
metal you may prefer.
For interconnects that need to go airborne, stay terrestrial or even go underground,
Fuzz Button® technology delivers the reliability you need!
Fuzz Buttons® ...Not Just For Rocket Science!
Custom Interconnects, LLC
7790 E. Arapahoe Rd, Suite 250
Centennial, CO 80112
Phone: 303.934.6600
Fax: 303.934.6606
Email: sales@custominterconnects.com
Custom Interconnects, LLC
7790 E. Arapahoe Rd, Suite 250
Centennial, CO 80112
Phone: 303.934.6600
Fax: 303.934.6606
Email: sales@custominterconnects.com
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For PCB Interposer Datasheet,
please click on the picture below:
please click on the picture below:
For PCB Interposer Stackups,
please click on the picture below:
please click on the picture below:
Introducing our new Thinnerposer Product Line
Click Here for Thinnerposer Product Sheet
Click Here for Thinnerposer Press Release
Click Here for Thinnerposer Product Sheet
Click Here for Thinnerposer Press Release
