Custom High-Density Interconnects | Fuzz Button® Technology

Custom Interconnects is the world's only manufacturer of .010" diameter Fuzz Button® contact pins, one of the smallest and highest‑density interconnect technologies available. For over 60 years, our proprietary Fuzz Button® technology has solved critical connectivity challenges in quantum computing, aerospace & defense, RF/microwave, and semiconductor applications. 

Unlike pogo pins or spring probes, Fuzz Buttons® are single-piece architecture: the signal element and the spring are one and the same. No moving parts. No points of failure. Superior signal integrity from DC to at least 40 GHz, making them the world’s most reliable and highest‑performing contact pin for demanding environments. 

  • Fuzz Button® Contact Pins: one of the world’s smallest at .010" diameter 
  • Custom Interposers & Connectors: high-density PCB stacking to 6,000+ I/O
  • RF / Coaxial Interconnects: impedance-matched to 100 GHz
  • Hardhat Pins & Probe Tips: up to 500,000 mating cycles
  • High Frequency RF / Coaxial Interconnects
  • Specialty EMI Shielding & Compliant Grounding

Fuzz Buttons

Fuzz Buttons® are high performance proprietary trademarked contact pins available ONLY from Custom Interconnects and manufactured ONLY in the USA. Fuzz Buttons® offer superior value to other contact technologies such as Pogo Pins, Spring Probes, Hyberboloid contacts or even soldering. This becomes especially evident when requirements such as low signal distortion, high frequency, low insertion force, planarity, shock/vibration resistance, weight and/or extended life come into play.

Fuzz Buttons® are available in a wide variety of diameters and lengths, with diameters ranging from .010" to .500" and lengths ranging from .030" to as long as .500". Most Fuzz Buttons® we manufacture are intended to address fine pitch contact requirements primarily at the 1mm pitch level, but also can serve applications with as small as a .4mm pitch. Fuzz Buttons® can mate to virtually any packaging type used in the market today - including PGA, BGA, LGA, CGA, QFN and MCM, as well as any custom packaging that a customer may be employing. This makes them ideal for use in PCB/PWB interposers, connectors, and chip packaging.

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Hardhats

Hardhats are the drivers behind maximizing the full mating cycle potential of Fuzz Button® technology.  With the added advantages of full stackup retention and automatic solder mask wiping, the Fuzz Button® / Hardhat contact system combines unsurpassed quality, value and performance.

Hardhats are primarily intended for high mating cycle applications (up to 500,000 cycles), such as Contactors, Test Fixtures and high mating cycle repeatable interconnects. However, in cases where Hardhats are utilized alone as Probe Tips, mating cycles can reach in excess of 1,000,000 cycles such as might be required for Probe Card Testers, In-circuit Test (ICT) or "Bed of Nails" Test Systems.

Hardhats are made from Gold-plated Beryllium Copper (Au/BeCu), offering high levels of conductivity, low resistance, oxidation prevention, high current capability (up to 10 Amps continuous), harsh environment tolerance (-60°C to 200C°) and excellent in-service life.

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Interposers

Custom Interconnects designs and manufactures a comprehensive line of customized Interposers and Connectors to support high density PCB stacking, packaging adaptation and solderless device mounting. While most applications require just a single use permanent mounting connection, Fuzz Button® Interposers and Connectors can actually be reutilized many hundreds or sometimes even thousands of times. This flexibility is ideal to allow for interconnect and/or device repurposing or in the event of a device failure.

Production is scalable from a single piece all the way to full OEM production quantities. Supported mating pad types include PGA, BGA, LGA, CGA and custom packaging. Most customers today utilize the Center-to-Center Contact Pitch of 1mm. The 1mm pitch is often regarded by customers as the perfect balance between pad/array size optimization and cost containment, while still offering excellent signal isolation and prevention of crosstalk.

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Applications

 We work with customers in military and commercial industries on a myriad of applications.  By combining our extensive experience, scalability and vast design library with our highly adaptable Fuzz Button® technology, we can offer specialized solutions for virtually any high performance connectivity requirements. 

Aerospace

Missiles & Rockets

Naval Seafaring Vessels

Quantum Computing

Satellites & Communications

Semiconductor

Test & Measurement

Weaponry Systems