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Custom Interconnects is a world renowned manufacturer in the high performance interconnect marketplace. For decades, Custom Interconnects and our proprietary Fuzz Button® technology have solved innumerable challenges for our customers, providing both value and reliability.

Fuzz Button® Contact Pins
Hardhat Pins / Probe Tips
Fuzz Button® / PTFE Sleeve Insulators
Low Z-axis PCB Interposers / Connectors
Fine Pitch Test Sockets / Contactors
High Frequency RF / Coaxial Interconnects
Specialty EMI Shielding
Compliant Grounding
For DC, VHF, UHF, L, S, C, X, Ku, Ka and Q Band applications

We work with customers in military and commercial industries on a myriad of applications. By combining our extensive experience, scalability and vast design library with our highly adaptable Fuzz Button® technology, we can offer specialized solutions for virtually any high performance connectivity requirements.

Fuzz Buttons

Fuzz Buttons® are high performance proprietary trademarked contact pins available ONLY from Custom Interconnects and manufactured ONLY in the USA. Fuzz Buttons® offer superior value to other contact technologies such as Pogo Pins, Spring Probes, Hyberboloid contacts or even soldering. This becomes especially evident when requirements such as low signal distortion, high frequency, low insertion force, planarity, shock/vibration resistance, weight and/or extended life come into play.

Fuzz Buttons® are available in a wide variety of diameters and lengths, with diameters ranging from .010" to .500" and lengths ranging from .030" to as long as .500". Most Fuzz Buttons® we manufacture are intended to address fine pitch contact requirements primarily at the 1mm pitch level, but also can serve applications with as small as a .4mm pitch. Fuzz Buttons® can mate to virtually any packaging type used in the market today - including PGA, BGA, LGA, CGA, QFN and MCM, as well as any custom packaging that a customer may be employing. This makes them ideal for use in PCB/PWB interposers, connectors, Test Sockets
and chip packaging.

Hardhats

Hardhats are the drivers behind maximizing the full mating cycle potential of Fuzz Button® technology. With the added advantages of full stackup retention and automatic solder mask wiping, the Fuzz Button® / Hardhat contact system combines unsurpassed quality, value and performance.

Hardhats are primarily intended for high mating cycle applications (up to 500,000 cycles), such as Test Sockets, Contactors, Test Fixtures and high mating cycle repeatable interconnects. However, in cases where Hardhats are utilized alone as Probe Tips, mating cycles can reach in excess of 1,000,000 cycles such as might be required for Probe Card Testers, In-circuit Test (ICT) or "Bed of Nails" Test Systems.

Hardhats are made from Gold-plated Beryllium Copper (Au/BeCu), offering high levels of conductivity, low resistance, oxidation prevention, high current capability (up to 10 Amps continuous), harsh environment tolerance (-60°C to 200C°) and excellent in-service life.

Interposers

Custom Interconnects designs and manufactures a comprehensive line of customized Interposers and Connectors to support high density PCB stacking, packaging adaptation and solderless device mounting. While most applications require just a single use permanent mounting connection, Fuzz Button® Interposers and Connectors can actually be reutilized many hundreds or sometimes even thousands of times. This flexibility is ideal to allow for interconnect and/or device repurposing or in the event of a device failure.

Production is scalable from a single piece all the way to full OEM production quantities. Supported mating pad types include PGA, BGA, LGA, CGA and custom packaging. Most customers today utilize the Center-to-Center Contact Pitch of 1mm. The 1mm pitch is often regarded by customers as the perfect balance between pad/array size optimization and cost containment, while still offering excellent signal isolation and prevention of crosstalk.