Hardhats are the drivers behind maximizing the full mating cycle potential of Fuzz Button® technology. With the added advantages of full stackup retention and automatic solder mask wiping, the Fuzz Button® / Hardhat contact system combines unsurpassed quality, value and performance.
Applications
Hardhats are primarily intended for high mating cycle applications (up to 500,000 cycles), such as Test Sockets, Contactors, Test Fixtures and high mating cycle repeatable interconnects. However, in cases where Hardhats are utilized alone as Probe Tips, mating cycles can reach in excess of 1,000,000 cycles such as might be required for Probe Card Testers, In-circuit Test (ICT) or "Bed of Nails" Test Systems.
Material Composition
Hardhats are made from Gold-plated Beryllium Copper (Au/BeCu), offering high levels of conductivity, low resistance, oxidation prevention, high current capability (up to 10 Amps continuous), harsh environment tolerance (-60°C to 200C°) and excellent in-service life.
Configurations
Standard Hardhats are available to match up with Fuzz Buttons in the diameters of .010", .015", .020" and .030", which would meet DUT package pitches of .5mm, .65mm, .8mm/1mm and 1.27mm respectively. Hardhats are available in several tip configurations to mate with BGA, LGA, CGA and QFN, as well as many other flip chip and chip scale packages. Custom Hardhats are also available for differing size, material composition or application requirements, please contact the factory for details.
How to use Hardhats
The Fuzz Button® / Hardhat stackup employs a tight tolerance counterbored hole structure, with the smaller hole diameter on the topside. This hole structure prevents the Hardhat from coming out the topside, as the shoulder of the Hardhat acts as a "stop". The Hardhat can then move freely up and down within the hole and butts up against the topside of the Fuzz Button® which is directly below it. The "rule of thumb" of topside protrusion of the Hardhat beyond the carrier plane is .010", but may vary based on design specifics. To load the stackup, the socket/interposer carrier is turned upside down, the Hardhats go first into the holes, then followed with the Fuzz Buttons®. Repeat for all positions in the socket/interposer array until done. Leaving the socket/interposer upside down, turn the PCB upside down also. Then align the PCB with the socket/interposer and follow the provided mounting instructions. Then you may turn the assembled socket/interposer and PCB into the upright position. The assembled unit should be exercised with a DUT or dummy package a minimum of 10 times to properly seat the stackup, after which you are then immediately ready to begin use.