RF / Coaxial Interconnects

Fuzz Button® technology is already inherently capable of 40GHz+ frequency performance. But, when a customer's device package and/or boards are able to accept it, Fuzz Buttons® can be arranged in a coaxial pattern for even better impedance matching, especially when targeting 50 Ohms impedance. In this optimized configuration, there is a central Fuzz Button® for the signal path and four to six surrounding Fuzz Buttons® arranged in a circle or semi-circle around it to provide compliant grounds. The recommended material for the substrate carrier in such an arrangement would be a high-Grade dielectric plastic, such as Ultem® 1000, PEEK or PTFE, which would provide sufficient isolation between the array positions. This coaxial pattern option can be incorporated into any of our products, including PCB interposers, test sockets and interconnects. Hardhats can be included in the stackup of such a coaxial structure, dependent on a requirement for high mating cycles.

Fuzz Button® RF Optimization
Many customers are looking to maximize the ground plane to further reduce signal parasitics. For these kinds of applications there is a variant of the coaxial structure in which the interposer or socket body is machined from a highly conductive material such as Aluminum or Brass. The circular coaxial pattern as earlier described is again employed, but this time the central signal Fuzz Button® is encased in a dielectric isolating/insulating sleeve (often Virgin PTFE) which is then press-fit or slip-fit into the metal body. The four to six surrounding Fuzz Buttons® are inserted directly into machined holes within the metal body to become compliant grounds. Although technically more challenging and costly than our other designs, when RF performance matters most, this is the most rewarding approach.


RF/Microwave Conversion Tables and Formulas

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