New Tile Structure for Microwave Modules Using Solderless Vertical Interconnections

This article proposes a new form of three-dimensional (3D) structure that can be easily constructed at a low cost. The proposed structure creates a set by combining a component attached layer-board using a frame-board as a spacer. Another element of the proposed structure stacks these sets to realize a tile structure similar to how a container house is built. Each set is connected through vertical interconnections by a solderless-method, using fuzz buttons. A tile structure active Transmit/Receive module is created, based on the proposed structure and is applied to an active phased array radar, operating in the 18 GHz frequency range. The fabricated module and its test results confirm that the proposed structure is cost efficient and easy to realize.